| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which a metal body for enhancing heat dissipation property can be disposed precisely at an appropriate position. <P>SOLUTION: The semiconductor device 10 includes a package 11 made of an insulating material, a semiconductor element 13 mounted on a top-surface side of the package 1, and the metal body 16 partially buried in the package 11 and partially exposed on the reverse-surface side of the package 11. The metal body 16 is in a shape having a step between the top-surface side and reverse-surface side of the package 11 at least partially on a side surface, and the interval between the side surface of the metal body 16a and a package internal wall surface opposed to the side surface is smaller on the top-surface side (Da) of the package 11 than on the reverse-surface side of the package 11. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
