| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing apparatus comprising a function capable of accurately detecting a contour of a wafer.SOLUTION: A processing apparatus is configured to process a wafer including a device area in which devices are formed over a plurality of areas sectioned by a plurality of scribe lines to be divided formed on a front surface in a lattice shape, and an outer peripheral surplus area which surrounds the device area and includes a chamfered part in an outer circumference. The processing apparatus comprises: a rotatable chuck table including a holding surface for holding the wafer; imaging means for imaging the outer circumferential part of the wafer held on the chuck table from an upper side; processing means for processing the outer circumferential part of the wafer held on the chuck table; X axis direction moving means for moving the chuck table in an X axis direction connecting an image region to be imaged by the imaging means and a process region to be processed by the processing means; and Y axis direction moving means for moving the chuck table and the processing means in a Y axis direction orthogonal to the X axis direction. The chuck table includes illumination means for irradiating light on the outer circumferential part of the wafer from a lower side to make the contour of the outer circumference clear when the wafer is held on the holding surface. |
