发明名称 |
AIRFLOW MEASURING APPARATUS |
摘要 |
Airflow measuring apparatus compring: sub-passage that takes in part of flow of fluid flowing through an intake pipe; sensor element that is disposed in the sub-passage to measure the flow of fluid; a circuit part that converts the flow of fluid detected by the sensor element into an electric signal; connector part connected to the circuit part to output a signal externally; and casing that supports the sensor element and the circuit part, the sensor element being disposed in the intake pipe. The sensor element includes a cavity disposed at a semiconductor substrate, a diaphragm including a thin film part that covers the cavity. The sensor element on a lead frame have surfaces that are mold-packaged with resin so that a diaphragm of the sensor element and part of the lead frame are exposed. One hole is disposed at the lead frame for communication between the cavity and exterior. |
申请公布号 |
US2014352424(A1) |
申请公布日期 |
2014.12.04 |
申请号 |
US201114363235 |
申请日期 |
2011.12.07 |
申请人 |
Morino Takeshi;Tashiro Shinobu;Tokuyasu Noboru;Doi Ryosuke;Hanzawa Keiji |
发明人 |
Morino Takeshi;Tashiro Shinobu;Tokuyasu Noboru;Doi Ryosuke;Hanzawa Keiji |
分类号 |
G01F1/684;H01L35/34;G01F1/692 |
主分类号 |
G01F1/684 |
代理机构 |
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代理人 |
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主权项 |
1. An airflow measuring apparatus comprising: a sub-passage that takes in a part of a flow of fluid flowing through an intake pipe; a sensor element that is disposed in the sub-passage to measure the flow of fluid; a circuit part that converts the flow of fluid detected by the sensor element into an electric signal; a connector part having a connector that is electrically connected to the circuit part to output a signal externally; and a casing that supports the sensor element and the circuit part, the sensor element being disposed in the intake pipe, wherein
the sensor element includes a cavity that is disposed at a semiconductor substrate, and a diaphragm including a thin film part that covers the cavity, the sensor element is mounted at a lead frame, the sensor element and the lead frame have surfaces that are mold-packaged with resin so that a diaphragm part of the sensor element and a part of the lead frame are exposed, and at least one hole is disposed at the lead frame for communication between the cavity and exterior of the mold package. |
地址 |
Hitachinaka JP |