发明名称 AIRFLOW MEASURING APPARATUS
摘要 Airflow measuring apparatus compring: sub-passage that takes in part of flow of fluid flowing through an intake pipe; sensor element that is disposed in the sub-passage to measure the flow of fluid; a circuit part that converts the flow of fluid detected by the sensor element into an electric signal; connector part connected to the circuit part to output a signal externally; and casing that supports the sensor element and the circuit part, the sensor element being disposed in the intake pipe. The sensor element includes a cavity disposed at a semiconductor substrate, a diaphragm including a thin film part that covers the cavity. The sensor element on a lead frame have surfaces that are mold-packaged with resin so that a diaphragm of the sensor element and part of the lead frame are exposed. One hole is disposed at the lead frame for communication between the cavity and exterior.
申请公布号 US2014352424(A1) 申请公布日期 2014.12.04
申请号 US201114363235 申请日期 2011.12.07
申请人 Morino Takeshi;Tashiro Shinobu;Tokuyasu Noboru;Doi Ryosuke;Hanzawa Keiji 发明人 Morino Takeshi;Tashiro Shinobu;Tokuyasu Noboru;Doi Ryosuke;Hanzawa Keiji
分类号 G01F1/684;H01L35/34;G01F1/692 主分类号 G01F1/684
代理机构 代理人
主权项 1. An airflow measuring apparatus comprising: a sub-passage that takes in a part of a flow of fluid flowing through an intake pipe; a sensor element that is disposed in the sub-passage to measure the flow of fluid; a circuit part that converts the flow of fluid detected by the sensor element into an electric signal; a connector part having a connector that is electrically connected to the circuit part to output a signal externally; and a casing that supports the sensor element and the circuit part, the sensor element being disposed in the intake pipe, wherein the sensor element includes a cavity that is disposed at a semiconductor substrate, and a diaphragm including a thin film part that covers the cavity, the sensor element is mounted at a lead frame, the sensor element and the lead frame have surfaces that are mold-packaged with resin so that a diaphragm part of the sensor element and a part of the lead frame are exposed, and at least one hole is disposed at the lead frame for communication between the cavity and exterior of the mold package.
地址 Hitachinaka JP