发明名称 ELECTROCONDUCTIVE PARTICLE, CIRCUIT CONNECTING MATERIAL, MOUNTING BODY, AND METHOD FOR MANUFACTURING MOUNTING BODY
摘要 <p>An electroconductive particle including an electroconductive layer made of copper or a copper alloy, or silver or a silver alloy, and a surface layer made of nickel or a nickel alloy and formed on the electroconductive layer is used. By use of the electroconductive particle obtained such that a surface is coated with hard nickel, and an inner side of a nickel layer is copper or silver having low specific resistance, low resistance and high reliability can be obtained. An electroconductive particle having low resistance and high reliability, a circuit connecting material containing electroconductive particles, a mounting body using a circuit connecting material, and a method for manufacturing a mounting body are provided.</p>
申请公布号 KR20140139022(A) 申请公布日期 2014.12.04
申请号 KR20147029435 申请日期 2013.03.22
申请人 DEXERIALS CORPORATION 发明人 TAMAKI TAKESHI;TANAKA YOSHITO
分类号 H01B1/02;B22F1/02;H01B1/22;H01L21/60;H01R11/01;H05K3/32 主分类号 H01B1/02
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