COPPER FOIL, COPPER FOIL WITH CARRIER, COPPER-CLAD LAMINATE, PRINTED CIRCUIT BOARD, CIRCUIT FORMING SUBSTRATE FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, RESIN SUBSTRATE, CIRCUIT FORMING METHOD, SEMIADDITIVE METHOD, AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD

摘要

Provided is a copper foil for use in a semiadditive method which, when laminated on a resin substrate and etched on the entire surface, has excellent adhesive force between a plating film and the etching surface of the resin substrate onto which the copper foil surface profile has been transferred. This copper foil comprises, in order, a copper foil bulk layer, a roughened layer, and a chrome-containing, anti-rust treated layer, wherein the copper foil is laminated onto the resin substrate from the side having the roughened layer, and, in the case of etching the entire surface of the copper foil using an etching liquid, when the etching surface of the resin substrate after the full-surface etching is subjected to surface analysis by XPS, then, defining the concentration by weight (wt%) of Cr, Zn, C, O and Si as A, B, C, D and E, respectively, the Cr content ratio (%) [=A/(A+B+C+D+E)×100] is 0.1-10%.