SEMICONDUCTOR OPTICAL PACKAGE AND METHOD

摘要

Embodiments of the present disclosure are directed to optical packages having a package body that includes a light protection coating on at least one surface of a transparent material. The light protection coating includes one or more openings to allow light to be transmitted to the optical device within the package body. In one embodiment, the light protection coating and the openings allow substantially perpendicular radiation to be directed to the optical device within the package body. In one exemplary embodiment the light protection coating is located on an outer surface of the transparent material. In another embodiment, the light protection coating is located on an inner surface of the transparent material inside of the package body.

主权项

1. An optical package comprising:
a semiconductor substrate having an upper surface; a first optical device configured to receive radiation at a first frequency range, the first optical device being formed in the upper surface of the semiconductor substrate; a transparent material having a first surface and an opposite second surface, the transparent material being located over the first optical device; and a first light protection coating located on the first surface of the transparent material, the first light protection coating having a first opening located over the first optical device, the first light protection coating having a thickness that is equal to or greater than a diameter of the first opening, the first light protection coating being substantially resistant to radiation at the first frequency range.