发明名称 Conductivity of resin materials and composite materials
摘要 A resin material is provided which comprises at least one thermoset resin, carbon conductive additive material, and at least one thermoplastic polymer resin. The thermoplastic polymer resin dissolves in the thermoset polymer resin and phase separates upon cure. There is also provided a method of making the resin material, and additionally a composite material that comprising said resin material in combination with a fibrous reinforcement. The resin material and composite material may each be used in an uncured or cured form, and may find particular use as a prepreg material.
申请公布号 US8900486(B2) 申请公布日期 2014.12.02
申请号 US200912996025 申请日期 2009.06.05
申请人 Hexcel Composites Limited 发明人 Simmons Martin;Cawse John
分类号 H01B1/24;C08K7/24;C08K7/06;C08G59/50;C08L53/00 主分类号 H01B1/24
代理机构 代理人 Bielawski W. Mark;Oldenkamp David J.
主权项 1. A cured resin material comprising: a non-thermoplastic polymer phase comprising cured epoxy resin; phase separated domains located within said non-thermoplastic polymer phase, said phase separated domains comprising thermoplastic polymer and having a size in the range of 20 to 5000 nanometers; and carbon conductive additive material comprising carbon nanofibres having a diameter of from 110 nanometers to 150 nanometers wherein said carbon conductive additive material is located only in said non-thermoplastic polymer phase so as to form an electrically conductive connective network therein.
地址 Duxford GB