发明名称 |
SEMICONDUCTOR DEVICE HAVING IMPROVED HEAT-DISSIPATION CHARACTERISTICS |
摘要 |
The present invention relates to a semiconductor device and, more specifically, to a semiconductor device having improved heat-dissipation characteristics, which is capable effectively discharging heat, which is generated inside the semiconductor device of a three-dimensional laminated structure, to the outside of the semiconductor device by utilizing an internal connector used during bonding. |
申请公布号 |
WO2014185665(A1) |
申请公布日期 |
2014.11.20 |
申请号 |
WO2014KR04180 |
申请日期 |
2014.05.09 |
申请人 |
SILICONFILE TECHNOLOGIES INC. |
发明人 |
AHN, HEUI GYUN;AHN, SANG WOOK;LEE, YONG WOON;JUNG, HUY CHAN;JUN, SUNG CHUN |
分类号 |
H01L23/34;H01L23/48 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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