发明名称 WIRELESS IC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a wireless IC device capable of reducing a preparation cost of a wrapper, attaching the wrapper even to a small article and suppressing the thickness of a tag formation section.SOLUTION: For example, a notched section 61 without an aluminum deposition film is formed at an end of an article wrapper 60 with an aluminum deposition laminate film and, at the notched section, an electromagnetic coupling module 1 is provided. A wireless IC device is constituted of the electromagnetic coupling module 1 and the aluminum deposition film on the wrapper 60. A magnetic field antenna of the electromagnetic coupling module 1 is joined to the aluminum deposition film on the wrapper 60, so that the whole article wrapper 60 acts as a radiator of the antenna.
申请公布号 JP2014220831(A) 申请公布日期 2014.11.20
申请号 JP20140145244 申请日期 2014.07.15
申请人 MURATA MFG CO LTD 发明人 KATO NOBORU;IKEMOTO NOBUO
分类号 H01Q7/00;H01Q1/38;H01Q1/50 主分类号 H01Q7/00
代理机构 代理人
主权项
地址