发明名称 Methods and systems for in-situ pyrometer calibration
摘要 A method of in-situ pyrometer calibration for a wafer treatment reactor such as a chemical vapor deposition reactor desirably includes the steps of positioning a calibrating pyrometer at a first calibrating position and heating the reactor until the reactor reaches a pyrometer calibration temperature. The method desirably further includes rotating the support element about the rotational axis, and while the support element is rotating about the rotational axis, obtaining first operating temperature measurements from a first operating pyrometer installed at a first operating position, and obtaining first calibrating temperature measurements from the calibration pyrometer. Both the calibrating pyrometer and the first operating pyrometer desirably are adapted to receive radiation from a first portion of a wafer support element at a first radial distance from a rotational axis of the wafer support element.
申请公布号 US8888360(B2) 申请公布日期 2014.11.18
申请号 US201113331112 申请日期 2011.12.20
申请人 Veeco Instruments Inc. 发明人 Gurary Alexander I.;Boguslavskiy Vadim;Krishnan Sandeep;King Matthew
分类号 G01K15/00;G01K13/12;G01K1/00;G01J5/00 主分类号 G01K15/00
代理机构 Lerner, David, Littenberg, Krumholz & Mentlik, LLP 代理人 Lerner, David, Littenberg, Krumholz & Mentlik, LLP
主权项 1. A method of in-situ pyrometer calibration for a wafer treatment reactor, comprising: (a) positioning a calibrating pyrometer at a first calibrating position so that the calibrating pyrometer is adapted to receive radiation from a first portion of a wafer support element at a first radial distance from a rotational axis of the wafer support element; (b) heating the reactor until the reactor reaches a pyrometer calibration temperature; (c) rotating the support element about the rotational axis; and (d) while the support element is rotating about the rotational axis, obtaining first operating temperature measurements from a first operating pyrometer installed at a first operating position so that the first operating pyrometer is adapted to receive radiation from the first portion of the wafer support element at the first radial distance from the rotational axis of the wafer support element; and (e) while the support element is rotating about the rotational axis, obtaining first calibrating temperature measurements from the calibration pyrometer.
地址 Plainview NY US