| 摘要 |
<p>Disclosed is a ball supplier for supplying solder balls to the top of a ball mask in a solder ball bumping device. The ball supplier according to the present invention comprises a ball supply container having multiple through holes on the bottom through which solder balls pass; a ball storage container which is coupled to the ball supply container and receives the solder balls to be supplied into the ball supply container; and a horizontal drive unit which moves the ball supply container on the ball mask in a horizontal direction. According to the present invention, the productivity of a ball bumping process is remarkably improved by automating the supply of the solder balls during a solder ball bumping process and easily removing the remaining solder balls. Also, the present invention prevents work defects caused by a brush because the ball supplier does not use the brush.</p> |
