发明名称 ポリイミドフィルム、これらの製造方法、及び金属積層ポリイミドフィルム
摘要 <p>The present invention provides a polyimide film having an anisotropic thermal expansion coefficient, and comprising a polyimide layer (b) and a polyimide layer (a) on one side or both sides of the polyimide layer (b), wherein the polyimide layer (a) is a layer of a polyimide prepared from a monomer component comprising a diamine having the structure of the following formula (1): wherein R represents a monovalent group selected from the groups listed as the following formula (2): wherein R1 represents a hydrogen atom or a methyl group, and two R1 groups may be the same as, or different from each other.</p>
申请公布号 JP5621767(B2) 申请公布日期 2014.11.12
申请号 JP20110509324 申请日期 2010.04.14
申请人 发明人
分类号 B32B27/34;B05D3/12;B05D7/04;B05D7/24;B29C55/02;B32B15/088;C08G73/10 主分类号 B32B27/34
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