发明名称 |
Resin composition for encapsulating semiconductor and semiconductor device |
摘要 |
Disclosed is a resin composition for encapsulating a semiconductor including a phenol resin (A) having one or more components containing a component (A1) composed of a polymer having a first structural unit and a second structural unit, an epoxy resin (B), and an inorganic filler (C). Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor. |
申请公布号 |
US8883883(B2) |
申请公布日期 |
2014.11.11 |
申请号 |
US201013322037 |
申请日期 |
2010.05.28 |
申请人 |
Sumitomo Bakelite Co., Ltd. |
发明人 |
Wada Masahiro |
分类号 |
C08G59/62;C08L63/00;C08L61/04;C08K3/00;H01L23/29;C08G59/68;H01L23/00 |
主分类号 |
C08G59/62 |
代理机构 |
Birch, Stewart, Kolasch & Birch, LLP |
代理人 |
Birch, Stewart, Kolasch & Birch, LLP |
主权项 |
1. A resin composition for encapsulating a semiconductor comprising a phenol resin (A) having one or more components containing a component (A1) composed of a polymer having a structural unit represented by the following general formula (1) and a structural unit represented by the following general formula (2);
an epoxy resin (B); and an inorganic filler (C), wherein, in the above general formula (1), R1 is each independently a hydrocarbon group having 1 to 6 carbon atoms; a is an integer of 0 to 3; and R2, R3, R4 and R5 are each independently a hydrogen atom or a hydrocarbon group having 1 to 6 carbon atoms, wherein, in the above general formula (2), R1 is each independently a hydrocarbon group having 1 to 6 carbon atoms; a is an integer of 0 to 3; R6 is each independently a hydrocarbon group having 1 to 6 carbon atoms; b is an integer of 1 to 4; and R7, R8, R9 and R10 are each independently a hydrogen atom or a hydrocarbon group having 1 to 6 carbon atoms, wherein the ICI viscosity at 150 degrees centigrade of said phenol resin (A) is equal to or less than 1.5 dPa·s; wherein a mixing amount of the phenol resin (A) is equal to or more than 0.5% by mass and equal to or less than 10% by mass based on the total mass of the resin composition; wherein a mixing amount of the epoxy resin (B) is equal to or more than 2% by mass and equal to or less than 15% by mass based on the total mass of the resin composition; and wherein the content of said inorganic filler (C) is equal to or more than 80% by mass and equal to or less than 93% by mass. |
地址 |
Tokyo JP |