| 发明名称 |
LAND GRID ARRAY INTERCONNECT FORMED WITH DISCRETE PADS |
| 摘要 |
A land grid array (LGA) includes a grid array of metal pads plated directly onto a printed circuit board, and a discrete metal pad soldered to each of the plated metal pads in the grid array. Each discrete metal pad has an exposed contact surface after soldering, and a thickness of each discrete metal pad is selected as a function of location in the grid array so that the discrete pads provide a locus of exposed surfaces having greater flatness than the printed circuit board. |
| 申请公布号 |
US2014326491(A1) |
申请公布日期 |
2014.11.06 |
| 申请号 |
US201414323048 |
申请日期 |
2014.07.03 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Pymento Larry G.;Sass Tony C.;Wormsbecher Paul A. |
| 分类号 |
H05K1/11;H05K1/09 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A land grid array, comprising:
a grid array of metal pads plated directly onto a printed circuit board; a discrete metal pad soldered to each of the plated metal pads in the grid array, wherein each discrete metal pad has an exposed contact surface after soldering, and wherein a thickness of each discrete metal pad is selected as a function of location in the grid array so that the discrete pads provide a locus of exposed surfaces having greater flatness than the printed circuit board. |
| 地址 |
Armonk NY US |
