| 发明名称 | Printed circuit board and method of manufacturing the same | ||
| 摘要 | Disclosed herein are a printed circuit board and a method of manufacturing the same, including: forming a protective layer on which a cover film is stacked on a base substrate; exposing the protective layer on which the cover film is stacked to photosensitize the protective layer and photodegrade the cover film; and developing the photodegraded cover film and the photosensitized protective layer to form an opening exposing a pad unit of a circuit layer which is an outermost layer of the base substrate on the protective layer, whereby the productivity of the printed circuit board can be improved without performing a process of separating a cover film. | ||
| 申请公布号 | US8865393(B2) | 申请公布日期 | 2014.10.21 |
| 申请号 | US201113213939 | 申请日期 | 2011.08.19 |
| 申请人 | Samsung Electro-Mechanics Co., Ltd. | 发明人 | Hong Dae Jo;Ryu Chang Sup;Choi Cheol Ho |
| 分类号 | G03F7/20;H05K3/30;H01L21/48;H01L23/498;H01L21/56;H05K3/28;H05K3/34;H01L23/00 | 主分类号 | G03F7/20 |
| 代理机构 | Bracewell & Giuliani LLP | 代理人 | Bracewell & Giuliani LLP ;Chin Brad Y. |
| 主权项 | 1. A method of manufacturing a printed circuit board, comprising: forming a protective layer on which a cover film is stacked on a base substrate; exposing the protective layer on which the cover film is stacked to photosensitize the protective layer and photodegrade the cover film; and developing the photodegraded cover film and the photosensitized protective layer to form an opening exposing a pad unit of a circuit layer which is an outermost layer of the base substrate on the protective layer. | ||
| 地址 | Gyunggi-Do KR | ||