ETCHANT COMPOSITION FOR COPPER-CONTAINING METAL FILM AND ETCHING METHOD USING THE SAME

摘要

Disclosed in the present invention is an etching composite for a copper containing metal film, which comprises: an amine derivative which is indicated as the below chemical formula 1; a fluorine containing compound which is indicated as one between the below chemical formula 2 and the below chemical formula 3; a second copper ion; and a mineral acid. In addition, disclosed in the present invention is also an etching method for a copper containing metal film, which includes a step of etching a copper containing metal film using the etching composite for a copper containing metal film.