ADHESIVE FILM, SEMICONDUCTOR DEVICE USING THE SAME AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive film that can control the wafer-fixing force on the dicing and the wafer-peeling force on the picking up and can apply the adhesive for semiconductor elements together with the film of the dicing process, a method of producing the semiconductor devices in which the production process can be simplified and semiconductor devices of high reliability. SOLUTION: This adhesive film has a structure in which the adhesive layer for adhering the semiconductor element onto the porous substrate material. The method of producing semiconductor devices characteristically comprises the step (a) that the adhesive layer side of the adhesive film is adhered to the back surface of the semiconductor wafer, the step (b) that the resultant semiconductor device adhered to the adhesive film is fixed to the dicing unit under reduced pressure or air-sucked pressure, the step (c) that the semiconductor device is detached between the porous substrate and the adhesive layer and the step (d) that the detached semiconductor device is adhered to the supporting substrate by thermo compression bonding. The semiconductor device is produced by bonding the semiconductor element to the support substrate through the adhesive in the adhesive film.