| 摘要 |
<p>The present invention relates to a composition comprises a polyester amide acid obtained from the reaction of a compound comprising tetracarboxylic dianhydride, a diamine and a polyhydric hydroxy compound, an epoxy compound comprising 2 to 20 epoxy groups per molecule and having a weight average molecular weight of not more than 5,000, and an imidazole compound, wherein the composition comprises a specific amount of each of the polyester amide acid, the epoxy compound, and the imidazole compound. By using the composition, a curing layer with excellent flatness, transparency and heat resistance can be formed.</p> |
