Heat dissipation structure and electronic apparatus

摘要

A heat dissipation structure includes a circuit board that is disposed inside an outer casing having a chassis formed with air inlet holes, and in which a first electronic component generating heat when driven and a second electronic component not generating heat when driven are mounted on one surface of a base plate, and a heat sink that releases the heat generated in the first electronic component. Here, in the heat sink, a heat dissipation unit positioned facing the base plate, an eaves portion protruding from the heat dissipation unit, and a pair of enclosing portions protruding from ends of the eaves portion in a direction perpendicular to a protruding direction from the heat dissipation unit, and at least one of the air inlet holes is formed in a position facing the eaves portion.

主权项

1. A heat dissipation structure comprising:
a circuit board that is disposed inside an outer casing having a chassis formed with at least one of air inlet holes for taking in cooling air from the outside, and in which a first electronic component which generates heat when driven and a second electronic component which does not generate heat when driven are mounted on one surface of a base plate; and a heat sink that is disposed on a surface side on which the first electronic component of the circuit board is mounted, and releases the heat generated in the first electronic component, wherein a gap is formed between the heat sink and the second electronic component, in the heat sink, a heat dissipation unit that is positioned so as to face the base plate of the circuit board, an eaves portion that protrudes from the heat dissipation unit to be positioned on the outside of an outer periphery of the base plate and guides, to the second electronic component, the cooling air flowing into the outer casing from the air inlet hole, and a pair of enclosing portions that respectively protrude from both ends of the eaves portion in a direction perpendicular to a protruding direction from the heat dissipation unit and are bent to the circuit board side with respect to the eaves portion are provided, and at least one of the air inlet holes of the chassis is formed in a position facing the eaves portion.