| 摘要 |
<p>Provided is a substrate processing method capable of inhibiting a substrate surface from being charged. According to the present invention, the substrate processing method comprises: a first processing step of rotating a substrate and supplying a liquid including pure water to the substrate; and a second processing step of rotating the substrate and supplying the liquid to the substrate after the first processing step. The second processing step is performed under the condition that the surface potential increase rate of the substrate is lower than that of the first processing step. For example, in the second processing step, the rotating speed of the substrate is lower than that of the first processing step.</p> |
