发明名称 System using multi-layer wire structure for high efficiency wireless communication
摘要 A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.
申请公布号 US8860545(B2) 申请公布日期 2014.10.14
申请号 US201113233663 申请日期 2011.09.15
申请人 NuCurrent, Inc. 发明人 Singh Vinit;Frysz Christine A.
分类号 H01F5/00 主分类号 H01F5/00
代理机构 McDermott, Will & Emery LLP 代理人 McDermott, Will & Emery LLP
主权项 1. A system of wire structures, the system comprising: a) a first wire structure comprising: i) a plurality of first conductors, each first conductor having a first conductor length, a first conductor height, a first conductor depth, and a first skin depth;ii) a first plurality of insulators, each insulator positioned between each of the plurality of first conductors; andiii) wherein the plurality of first conductors and first insulators are arranged to form the first wire structure having a first wire structure length, a first wire structure width and a first wire structure depth; b) a second wire structure comprising: i) a plurality of second conductors, each second conductor having a second conductor length, a second conductor height, a second conductor depth, and a second skin depth;ii) a second plurality of insulators, each insulator positioned between each of the plurality of second conductors; andiii) wherein the plurality of second conductors and second insulators are arranged to form the second wire structure having a second wire structure length, a second wire structure width and a second wire structure depth; and c) wherein a first electrical signal is propagatable through the first wire structure and the first skin depth, and a second electrical signal is inducible through the second wire structure, the second electrical signal being propagatable through the second skin depth.
地址 Chicago IL US