发明名称 CUTTING METHOD AND CUTTING DEVICE
摘要 PROBLEM TO BE SOLVED: To achieve reduction of a cutting time while maintaining accuracy on a cutting position of a film material.SOLUTION: A cutting method of the invention relates to a method in which a long film in which plural processing parts are formed intermittently is drawn out and the film is cut at specified positions. The cutting method includes a process for cutting the film material at a first cutting position by cutting means, a process in which position detection of a processing part is started at the more upstream side than the cutting means in the drawing direction of the film material before the cutting means cuts the film material and after operation of the cutting means is started at the first cutting position, and a process for calculating a second cutting position to be cut after the first cutting position on the basis of the detected position of the processing part.
申请公布号 JP2014188658(A) 申请公布日期 2014.10.06
申请号 JP20130069043 申请日期 2013.03.28
申请人 NEC CORP 发明人 IKEDA YUZO
分类号 B26D5/32 主分类号 B26D5/32
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