| 摘要 |
PROBLEM TO BE SOLVED: To suppress a conduction defect at the contact point of a conductive pattern to electrically contact to another member, in a structure having the conductive pattern formed on a first resin layer and a second resin layer molded thereon.SOLUTION: A first resin layer (1) includes a covered area covered with a second resin layer (2) and an exposed area (1a). A contact point part (1b) is disposed on the exposed area (1a). Further, a bent part (1c) is disposed between the boundary of the covered area and the exposed area (1a) and the contact point part (1b). |
