| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a transfer apparatus capable of implementing a process from overlapping a device substrate and a donor substrate to transferring a transfer material through light irradiation consistently in vacuum.SOLUTION: The transfer apparatus comprises: a vacuum chamber 30 in which a device substrate 10 and a donor substrate 20 are disposed; a substrate holding mechanism 50 for holding at least the donor substrate 20 within the vacuum chamber 30, the substrate holding mechanism 50 being configured to make a transferred surface of the device substrate 10 that is a surface on which a transfer material is transferred, opposite to a transfer surface of the donor substrate 20 that is a surface in which a transfer layer is provided, and to hold the device substrate 10 and the donor substrate 20 while overlapping them; and an opening 307 emitting light towards the substrate holding mechanism 50. The substrate holding mechanism 50 includes at least one light permeable portion through which light emitted from the opening 307 is permeated and which is movable with respect to the donor substrate 20.</p> |
