| 主权项 |
1. A sputtering apparatus comprising:
a cathode body on which a target can be arranged; a cathode magnet configured to generate a magnetic field on a surface of the target arranged on said cathode body; a magnet driving device configured to rotate said cathode magnet and move said cathode magnet close to or away from said cathode body; and a power application device configured to apply power to set said cathode body and said cathode magnet to an equipotential, wherein said magnet driving device includes a magnet support portion connected to said cathode magnet, and a slide support unit configured to support said magnet support portion to be movable in a direction to move close to or away from said cathode body, and said power application device supplies the power to said cathode magnet via said slide support unit. |
