摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounting device or an electronic component mounting method which allows for reliable confirmation of component data, while preventing bad production.SOLUTION: In an electronic component mounting device and an electronic component mounting method performing confirmation test of component data indicating the features of an electronic component before being mounted on a substrate, when the outer shape of the electronic component is larger than the image visual field dimension, split imaging is performed so as to capture the entirety of the electronic component by dividing the imaging into multiple times, and whole component image data representing the whole electronic component is obtained by synthesizing a plurality of captured image data obtained by multiple times of imaging, and the confirmation test is performed by superposing the whole component image data and corresponding graphics. |