| 摘要 |
The present invention relates to a wafer polishing apparatus capable of rapidly and smoothly discharging slurry and foreign substances supplied during a polishing process. The slurry is supplied between an upper surface plate and a lower surface plate, and a wafer engaged between the upper surface plate and the lower surface plate is polished while the upper surface plate and the lower surface plate rotates. The lower surface plate includes a lower surface plate body having a hole for introducing the slurry; and a storage body which is installed on the lower side of the lower surface plate body and is capable of storing the slurry flowing down from the hole of the lower surface plate body. The storage body is installed to be separated by sliding in the horizontal direction to the lower surface plate body. |
