POLYAMIDE MOULDING COMPOUND AND MOULDED ARTICLES PRODUCED HEREFROM

摘要

The present invention relates to a polyamide molding compound formed with: polyamide (PA MACM12) formed with bis (3-methyl-4-aminocyclohexyl) methane (MACM) and dodecanedioic acid; polyamide (PA PACM12) formed with bis (4-aminocyclohexyl) methane (PACM) and dodecanedioic acid; polyamide (PA PACM10) formed with bis (3-methyl-4-amino cyclohexyl) methane and decanedioic acid; polyamide (PA PACM10) which is formed with bis (4-amino cyclohexyl) methane (PACM) and decanedioic acid; polyamide (PA MACM14) formed with bis (3-methyl-4-amino cyclohexyl) methane (MACM) and tetradecanedioic acid; and polyamide (PA PACM14) which is formed with bis (4-amino-cyclohexyl by Sykes) methane (PACM) and tetradecanedioic acid; a mixture of those; and copolyamide.