发明名称 |
Method of forming polysilicon layer and method of manufacturing thin film transistor using the polysilicon layer |
摘要 |
In one aspect, a method of forming a polysilicon (poly-Si) layer and a method of manufacturing a thin film transistor (TFT) using the poly-Si layer is provided. In one aspect, the method of forming a polysilicon (poly-Si) layer includes forming an amorphous silicon (a-Si) layer on a substrate in a chamber; cleaning the chamber; removing fluorine (F) generated while cleaning the chamber; forming a metal catalyst layer for crystallization, on the a-Si layer; and crystallizing the a-Si layer into a poly-Si layer by performing a thermal processing operation. |
申请公布号 |
US8841194(B2) |
申请公布日期 |
2014.09.23 |
申请号 |
US201213485684 |
申请日期 |
2012.05.31 |
申请人 |
Samsung Display Co., Ltd. |
发明人 |
Park Jong-Ryuk;Chung Yun-Mo;Lee Tak-Young;Lee Kil-Won |
分类号 |
H01L21/336;H01L21/20 |
主分类号 |
H01L21/336 |
代理机构 |
Knobbe Martens Olson & Bear LLP |
代理人 |
Knobbe Martens Olson & Bear LLP |
主权项 |
1. A method of forming a polysilicon (poly-Si) layer, the method comprising:
forming an amorphous silicon (a-Si) layer on a substrate in a chamber; cleaning the chamber; removing fluorine (F) generated while cleaning the chamber; forming a metal catalyst layer on the a-Si layer; and crystallizing the a-Si layer into a poly-Si layer by performing a thermal processing operation. |
地址 |
Yongin, Gyeonggi-Do KR |