DAISY CHAIN CONNECTION FOR TESTING CONTINUITY IN A SEMICONDUCTOR DIE

摘要

An integrated circuit product package configured to continuity testing is described. The integrated circuit product package includes a package substrate. The package substrate includes internal routing connections. The integrated circuit product package also includes a semiconductor die coupled to the package substrate. The semiconductor die includes input/output (I/O) pins and switches. The switches selectively coupled the I/O pins to facilitate a daisy chain connection. The daisy chain connection includes circuitry fabricated on the semiconductor die, more than two of the internal routing connections, more than two of the I/O pins and at least one switch.

主权项

1. An integrated circuit product package configured for continuity testing, comprising:
a package substrate comprising internal routing connections; and a semiconductor die coupled to the package substrate, wherein the semiconductor die comprises input/output pins and switches, and wherein the switches selectively couple the input/output pins to facilitate a daisy chain connection, wherein the daisy chain connection comprises circuitry fabricated on the semiconductor die, more than two of the internal routing connections, more than two of the input/output pins and at least one switch.