Sealing frame and method for covering a component

摘要

A sealing frame for delimiting a surface of a component which is to be covered with a molding compound includes an upper frame part and a lower frame part which may be detachably joined together. The component to be covered with the molding compound is enclosable by the upper frame part and the lower frame part in such a way that a cavity is formed by the sealing frame and the component. The component is inserted into the upper frame par and lower frame part, and the upper and lower frame part are joined to form the sealing frame, so that the cavity is formed which is enclosed by the component and the upper frame part, and a molding compound is introduced into the cavity and cured to form a cover.

主权项

1. A sealing frame for delimiting a surface of a component to be covered by a molding compound, comprising:
an upper frame part; and a lower frame part; wherein the upper frame part and the lower frame part are configured to be detachably joined together and configured to enclose at least a main portion of the component to create a boundary around a perimeter of the component while exposing the main portion through a cavity in the upper frame part, to be subsequently covered by the molding compound in such a way that the cavity is defined by the upper frame part and wherein the component is sealed by the molding compound introduced into the cavity.