| 摘要 |
PROBLEM TO BE SOLVED: To prevent a multiple substrate from being warped by heat in component mounting and a heat stress from a mold resin while excluding unnecessary components and unnecessary steps as further as possible in a manufacturing method of an electronic device by which an electronic component is mounted on one side of the multiple substrate, the one side is sealed by the mold resin together with the electronic component, and the multiple substrate is then individualized for the unit of a substrate.SOLUTION: A manufacturing method includes the steps of: mounting an electronic component 20a on one side 1a of a multiple substrate 1 while fixing a support plate 40 on another side 1b of the multiple substrate 1, the multiple substrate 1 being formed by integrally connecting a plurality of substrates 10; sealing the one side 1b of the multiple substrate 1 by a mold resin 30 together with the electronic component 20; and performing dicing-cut on the multiple substrate 1 and the support plate 40 together with the mold resin 30. The support plate 40 fixed to the individualized substrate 10 is used as a radiator plate. |
