| 摘要 |
PROBLEM TO BE SOLVED: To provide a double-side lapping method that causes no spring-back phenomenon after completion of grind polishing with the application of pressure and enables efficient grind polishing while removing warp.SOLUTION: After an adhesive and curable synthetic resin is applied on the front and back surfaces of a plate-like body 1 that is the workpiece to form a hard synthetic resin layer so that front and back surfaces of the plate-like body may be almost parallel planes, the plate-like body 1 is sandwiched by a pair of the upper and lower turning surface tables 4 of a double-side lapping plate to make the turning surface tables 4 reversely rotate with each other while applied with pressure, so that firstly the hard synthetic resin layer and then the front and back surfaces of the plate-like body 1 coated with this layer are grind polished sequentially by a polishing body remaining fixed on the slide mating surface of the turning surface tables 4 to cut off a protrusion part caused by warp, thereby the warp of the plate-like body 1 is eliminated to obtain a parallel plane having a desired smoothness. |
