| 摘要 |
PROBLEM TO BE SOLVED: To substantially improve a cooling box with regard to thermal dissipation.SOLUTION: The present invention relates to a cooling box (1) for electric or electronic components, or circuits. The cooling box (1) is composed of a material, is non-electrically conductive or practically non-electrically conductive, is configured in one piece or multiple pieces, and has a cavity (4) enclosed by the material, the cavity (4) being closed or provided with at least one opening (2). To improve thermal dissipation, at least one surface region of the cooling box (1) is defined by functions of electrical and/or thermal conductivity. |
