| 摘要 |
PROBLEM TO BE SOLVED: To improve electrical connection reliability of a main terminal and a control terminal in a semiconductor device in which the main terminal and the control terminal are exposed from a second surface of an encapsulation resin body.SOLUTION: A semiconductor device comprises: a heat sink (24) having a heat radiation surface (24a) opposite to a surface on a semiconductor element (12) side, which is exposed from a first surface (36a) of an encapsulation resin body (36); a main terminal (28) having one end face (28a) opposite to an electrical connection part with a main electrode (14), the one end face (28a) being only exposed from the encapsulation resin body and exposed from a second face (36b) in a state where the end face is flush with the surrounding of the end face; and a control terminal (32) having one end face (32a) opposite to an electrical connection part with a control electrode (16), the one end face (32a) being only exposed from the encapsulation resin body and exposed from the second face in a state where the end face is flush with the surrounding of the end face. The main terminal and the control terminal are composed of the same lead frame (40). A part of the lead frame is cut together with the encapsulation resin body on the second face side. The lead frame and the encapsulation resin body are electrically insulated from each other. |
