发明名称 Male end of a telemetric transceiver
摘要 The present invention relates to an electronic device which has a male connection portion for connection with a female snap. The male connection portion comprises a conductive stud which is or can be screwed in to a portion of the electronic device via threading on the stud. Furthermore, an adhesive can be added to the stud or an opening of the electronic device in order to provide a secure and water tight seal between the stud and the electronic device. The stud generally makes an electrical connection between a conductive portion of the female snap and an electronic component within the electronic device. The male portion of the stud may also comprise a cavity or opening for receiving a tool for screwing the stud in to the electronic device and/or for receiving a guiding pin of the female snap portion.
申请公布号 US8814574(B2) 申请公布日期 2014.08.26
申请号 US201313832736 申请日期 2013.03.15
申请人 Suunto Oy 发明人 Selby Tapio;Pernu Kimmo
分类号 H01R33/00;A61B5/0245;A61B5/00;A61B5/0488;A61B5/0402;H01R9/18 主分类号 H01R33/00
代理机构 Seppo Laine Oy 代理人 O'Brien Terence P.;Seppo Laine Oy
主权项 1. An electronic device having a housing and at least one male connection portion for detachably connection the electronic device to a female snap, said male connection portion comprising a stud having: a male head portion capable of fitting within a socket region of a snap, wherein the male head portion has a terminal end which is the terminal end of the stud and a second end which separates the male head portion from a mid-portion, an end portion opposite the male head portion, wherein the end portion has a terminal end which is second terminal end of the stud, the end portion extending a first distance from the second terminal end of the stud, a mid-portion between the male head portion and the end portion, and the stud is in electrical contact with an electronic component of the electronic device, wherein at least a portion of the mid-portion is threaded, and at least a portion of the threaded mid-portion is in contact with an adhesive.
地址 Helsinki FI
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