发明名称 |
Process for enhancing image quality of backside illuminated image sensor |
摘要 |
A method of forming an image sensor device includes forming a light sensing region at a front surface of a silicon substrate and a patterned metal layer there over. Thereafter, the method also includes performing an ion implantation process to the back surface of the silicon substrate and performing a green laser annealing process to the implanted back surface of the silicon substrate. The green laser annealing process uses an annealing temperature greater than or equal to about 1100° C. for a duration of about 100 to about 400 nsec. After performing the green laser annealing process, a silicon polishing process is performed on the back surface of the silicon substrate. |
申请公布号 |
US8815723(B2) |
申请公布日期 |
2014.08.26 |
申请号 |
US201113335817 |
申请日期 |
2011.12.22 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Lu Shou Shu;Huang Hsun-Ying;Lin I-Chang;Hsiao Chia-Chi;Chang Yung-Cheng |
分类号 |
H01L21/22;H01L27/146 |
主分类号 |
H01L21/22 |
代理机构 |
Haynes and Boone, LLP |
代理人 |
Haynes and Boone, LLP |
主权项 |
1. A method comprising providing a substrate having a first surface and a second surface, the first surface being opposite the second surface;
forming a light sensing region at the first surface of the substrate; forming a metal layer above the first surface of the substrate; forming a doped layer at the second surface of the substrate using a laser annealing process; and performing a chemical mechanical polishing process on the annealed, doped layer. |
地址 |
Hsin-Chu TW |