发明名称 Process for enhancing image quality of backside illuminated image sensor
摘要 A method of forming an image sensor device includes forming a light sensing region at a front surface of a silicon substrate and a patterned metal layer there over. Thereafter, the method also includes performing an ion implantation process to the back surface of the silicon substrate and performing a green laser annealing process to the implanted back surface of the silicon substrate. The green laser annealing process uses an annealing temperature greater than or equal to about 1100° C. for a duration of about 100 to about 400 nsec. After performing the green laser annealing process, a silicon polishing process is performed on the back surface of the silicon substrate.
申请公布号 US8815723(B2) 申请公布日期 2014.08.26
申请号 US201113335817 申请日期 2011.12.22
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Lu Shou Shu;Huang Hsun-Ying;Lin I-Chang;Hsiao Chia-Chi;Chang Yung-Cheng
分类号 H01L21/22;H01L27/146 主分类号 H01L21/22
代理机构 Haynes and Boone, LLP 代理人 Haynes and Boone, LLP
主权项 1. A method comprising providing a substrate having a first surface and a second surface, the first surface being opposite the second surface; forming a light sensing region at the first surface of the substrate; forming a metal layer above the first surface of the substrate; forming a doped layer at the second surface of the substrate using a laser annealing process; and performing a chemical mechanical polishing process on the annealed, doped layer.
地址 Hsin-Chu TW