Interconnect Joint Protective Layer Apparatus and Method

摘要

Disclosed herein is a mechanism for forming an interconnect comprising forming a connector on an interconnect disposed on a first surface of a first substrate and applying a nonconductive material in a non-liquid form over the interconnect after forming the connector. The nonconductive material covers at least a lower portion of the interconnect, and at least a portion of the interconnect is exposed. The nonconductive material is formed around the connector by pressing the nonconductive material over the connector with a roller. An angle between a top surface of the nonconductive material and a connector sidewall between about 65 degrees and about 135 degrees. The nonconductive material may be formed to extend under the connector.

主权项

1. A method of forming an interconnect, comprising:
forming an connector on an interconnect disposed on a first surface of a first substrate, the connector comprising a conductive material; and applying a nonconductive material in a non-liquid form over the interconnect after forming the connector, the nonconductive material covering at least a lower portion of the interconnect, at least a portion of the interconnect being exposed.