RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

A resin-encapsulated semiconductor device includes a semiconductor element mounted on a die pad portion, a plurality of lead portions arranged so that leading end portions thereof are opposed to the die pad portion, and thin metal wires for connecting together electrodes of the semiconductor element and the lead portions. Those members are partially encapsulated by a resin. A bottom surface part of the die pad portion and a lead bottom surface part, an outer surface part, and an upper end part of the lead portion are exposed from the encapsulation resin. After a cutout part devoid of the encapsulation resin is formed above a lead upper end part, a plating layer is formed on the lead bottom surface part and the lead upper end part.

主权项

1. A resin-encapsulated semiconductor device, comprising:
a die pad portion; a semiconductor element mounted on the die pad portion; a plurality of lead portions arranged so as to be opposed to at least two sides of the die pad portion; thin metal wires for connecting together the plurality of lead portions and a plurality of electrodes provided on a surface of the semiconductor element; and an encapsulation resin for encapsulating the die pad portion, the semiconductor element, and the plurality of lead portions in a manner that the plurality of lead portions are partially exposed, wherein the plurality of lead portions each comprise a lead bottom surface part that is a bottom surface exposed from the encapsulation resin, a lead outer surface part that is a leading end, and a lead upper end part that is a part of an upper surface, wherein the lead bottom surface part is flush with a bottom surface of the encapsulation resin, wherein the lead bottom surface part and the lead upper end part each have a plating layer thereon, and wherein the encapsulation resin is present vertically above the lead upper end part via a cutout part devoid of the encapsulation resin.