发明名称 |
METHOD FOR FABRICATING QUAD FLAT NON-LEADED PACKAGE STRUCTURE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING FUNCTION |
摘要 |
A quad flat non-leaded (QFN) package structure with an electromagnetic interference (EMI) shielding function is proposed, including: a lead frame having a die pad, a plurality of supporting portions connecting to the die pad and a plurality of leads disposed around the periphery of the die pad without connecting to the die pad; a chip mounted on the die pad; bonding wires electrically connecting the chip and the leads; an encapsulant for encapsulating the chip, the bonding wires and the lead frame and exposing the side and bottom surfaces of the leads and the bottom surface of the die pad; and a shielding film disposed on the top and side surfaces of the encapsulant and electrically connecting to the supporting portions for shielding from EMI. A method of fabricating the package structure as described above is further proposed. |
申请公布号 |
US2014227830(A1) |
申请公布日期 |
2014.08.14 |
申请号 |
US201414253324 |
申请日期 |
2014.04.15 |
申请人 |
SILICONWARE PRECISION INDUSTRIES CO., LTD. |
发明人 |
Yao Chin-Tsai;Huang Chien-Ping;Ke Chun-Chi |
分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Taichung TW |