| 摘要 |
A laser component comprises a housing (100) and a laser chip (400) arranged in the housing. The housing has a first soldering contact (112) and a second soldering contact (122) on a first outer face (210). The housing has a third soldering contact (113) and a fourth soldering contact (123) on a second outer face (220). The first soldering contact is connected in an electrically conductive manner to the third soldering contact. The second soldering contact is connected in an electrically conductive manner to the fourth soldering contact. The housing comprises a carrier substrate (200) and a cover (300). An underside of the laser chip is arranged on the carrier substrate. The cover comprises a casting material. The laser chip is covered by the casting material. A radiation direction of the laser chip is oriented parallel to the underside (402) of the laser chip. Simplifies the application of a laser diode unit (10) to e.g. a printed circuit board (500) as a "toplooker" or "sidelooker". |
