Electronic device package, electronic device, and electronic apparatus

摘要

A package includes a base member and a lid member joined to the base member while forming, between the lid and base members, an internal space which stores an electronic component. A joined section of the base and lid members includes a first welded section formed by joining the base and lid members along an x axis direction using seam welding and a second welded section formed by joining the base and lid members along a y axis direction using the seam welding. In plan view, the first and second welded sections do not overlap each other. An area where an area formed by extending the first welded section in the x axis direction and an area formed by extending the second welded section in the y axis direction overlap each other is located on the outer side with respect to the contour of the lid member.

主权项

1. An electronic device package comprising:
a base member; and a lid member having, in plan view, a pair of first sides, which extend along a first direction, and a pair of second sides, which extend along a second direction crossing the first direction, and arranged on the base member while forming, between the lid member and the base member, an internal space in which an electronic component is housed, wherein a joined section of the base member and the lid member includes a first welded section formed by joining the base member and the lid member along the first sides using seam welding and a second welded section formed by joining the base member and the lid member along the second sides using the seam welding, and in plan view, the first welded section and the second welded section do not overlap each other, and an area where an area formed by extending the first welded section in the first direction and an area formed by extending the second welded section in the second direction overlap each other is located on an outer side with respect to a contour of the lid member.