发明名称 COOLING ASSEMBLY
摘要 A cooling assembly includes a device chamber, a cooling chamber separated from the device chamber, a heat exchanger, a device chamber fan arrangement and a control unit. The heat exchanger includes a first portion located in the device chamber and a second portion located in the cooling chamber for transferring heat from the device chamber to the cooling chamber. The device chamber fan arrangement is configured to generate a device chamber cooling medium flow including a first partial flow interacting with the first portion of the heat exchanger. The cooling assembly also includes a first throttle arrangement for regulating the first partial flow. The control unit is configured to reduce a cooling power of the heat exchanger as a response to predetermined operating conditions by decreasing the first partial flow with the first throttle arrangement.
申请公布号 US2014216681(A1) 申请公布日期 2014.08.07
申请号 US201414172280 申请日期 2014.02.04
申请人 ABB Oy 发明人 MANNINEN Jorma;Koivuluoma Timo;Lehto Jaakko
分类号 F28F27/00 主分类号 F28F27/00
代理机构 代理人
主权项 1. A cooling assembly comprising: a device chamber; a cooling chamber separated from the device chamber; a heat exchanger; device chamber fan means; and control means, wherein: the heat exchanger comprises a first portion located in the device chamber and a second portion located in the cooling chamber for transferring heat from the device chamber to the cooling chamber; the device chamber fan means are configured to generate a device chamber cooling medium flow including a first partial flow interacting with the first portion of the heat exchanger; the cooling assembly comprises first throttle means for regulating the first partial flow; the control means are configured to reduce a cooling power of the heat exchanger as a response to predetermined operating conditions by decreasing the first partial flow with the first throttle means.
地址 Helsinki FI