| 摘要 |
The present invention relates to a bonding device and, more specifically, to a bonding device for bonding a first member and a plate-shaped second member not to be damaged without making bubbles therein. According to an embodiment of the present invention, the bonding device for bonding a plate-shaped second member to the bonding surface of a first member comprises: a first jig which has space having an opening and includes a first member fixed to the inner surface to form the space, a second member supported in the outer part thereof so that the second member can approach/retreat to/from the first member while the second member faces the bonding surface of the first member, a vacuum hole to discharge air from the space, and an elastic body to block the air to cover the surrounding of the opening; and a second jig which approaches/retreats to/from the opening of the first jig and blocks the air not to be introduced into the space through the opening by being in contact with the elastic body of the first jig to cover the opening. The second jig is in contact with the elastic body to block the air introducing into the inside of the space from the outside, and the air is discharged from the space through the vacuum hole to contract the elastic body. Thereby, the first member and the second member are compressed when the second jig presses the second member. |
