发明名称 POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION
摘要 <p>Disclosed is a positive photosensitive resin composition that includes (A) a polybenzoxazole precursor including a repeating unit represented by the following Chemical Formula 1; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a phenol compound; and (E) a solvent. In the above Chemical Formula 1, each substituent is the same as defined in the specification.</p>
申请公布号 KR101423539(B1) 申请公布日期 2014.07.25
申请号 KR20100130786 申请日期 2010.12.20
申请人 发明人
分类号 G03F7/016;G03F7/039;H01L21/027 主分类号 G03F7/016
代理机构 代理人
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