| 发明名称 |
ELECTRONIC COMPONENT |
| 摘要 |
An electronic component includes: a wiring substrate; a passive component that includes a substrate, a coil located on an upper surface of the substrate, and a terminal located on a lower surface of the substrate and electrically connected to the coil, and is mounted on an upper surface of the wiring substrate by using the terminal; and a grounding wiring that is located on the wiring substrate and overlaps with the coil in a thickness direction of the wiring substrate. |
| 申请公布号 |
US2014197915(A1) |
申请公布日期 |
2014.07.17 |
| 申请号 |
US201314091851 |
申请日期 |
2013.11.27 |
| 申请人 |
TAIYO YUDEN CO., LTD. |
发明人 |
SATO Masahiro;TAJIMA Motoyuki;SAKINADA Kaoru |
| 分类号 |
H01F27/29 |
主分类号 |
H01F27/29 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic component comprising:
a wiring substrate; a passive component that includes a substrate, a coil located on an upper surface of the substrate, and a terminal located on a lower surface of the substrate and electrically connected to the coil, and is mounted on an upper surface of the wiring substrate by using the terminal; and a grounding wiring that is located on the wiring substrate and overlaps with the coil in a thickness direction of the wiring substrate. |
| 地址 |
Tokyo JP |
