| 摘要 |
PROBLEM TO BE SOLVED: To prevent change in characteristics of a semiconductor chip and poor connection between a semiconductor substrate and a mounting substrate.SOLUTION: An electronic component with bump comprises a circuit board 1, and bumps B1, B2 which are formed on a substrate principal surface of the circuit board 1 and which have different cross sectional areas in a direction parallel with the substrate principal surface. The bump B1 among the bumps B1, B2 which has a smaller cross sectional area has a height control layer 5 in a vertical direction. |
