| 发明名称 |
SOCKET TYPE MEMS BONDING |
| 摘要 |
A method for fabricating an integrated circuit device is disclosed. The method includes providing a first substrate; bonding a second substrate to the first substrate, the second substrate including a microeelectromechanical system (MEMS) device; and bonding a third substrate to the first substrate. |
| 申请公布号 |
US2014193949(A1) |
申请公布日期 |
2014.07.10 |
| 申请号 |
US201414204472 |
申请日期 |
2014.03.11 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company Ltd. |
发明人 |
Wu Ting-Hau |
| 分类号 |
B81C1/00 |
主分类号 |
B81C1/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method comprising:
providing a first substrate; bonding a second substrate to the first substrate, the second substrate including a microeelectromechanical system (MEMS) device; and bonding a third substrate to the first substrate. |
| 地址 |
Hsin-Chu TW |
