Method of inspecting printed circuit board, method of manufacturing printed circuit board and inspection device of printed circuit board

摘要

A plurality of assembly sheets are placed on an upper surface of a substrate adsorption platform, and a pressing plate is placed on the plurality of assembly sheets placed on the substrate adsorption platform such that the plurality of assembly sheets are pressed by the pressing plate. In this state, a DC power supply device is turned on and causes the upper surface of the substrate adsorption platform to be charged, thereby causing the plurality of assembly sheets to be adsorbed on the upper surface by an electrostatic force. Then, the pressing plate placed on the plurality of assembly sheets is removed while the upper surface of the substrate adsorption platform is charged, and automatic appearance inspection is performed on the plurality of assembly sheets adsorbed on the upper surface of the substrate adsorption platform.

主权项

1. A method of inspecting a printed circuit board comprising the steps of:
placing said printed circuit board on a flat uncharged support surface of an adsorption platform; after placing said printed circuit board on said support surface, placing a pressing member on said printed circuit board placed on said support surface such that an entire upper surface of said printed circuit board is pressed by a flat insulating pressing surface of said pressing member while said support surface is uncharged, and while said printed circuit board is not adsorbed on said support surface, wherein said pressing surface of said pressing member is configured to come into contact with the entire upper surface of said printed circuit board; after placing said pressing member on said printed circuit board, adsorbing said printed circuit board on said support surface by an electrostatic force by charging said support surface while said printed circuit board and said pressing member are placed on said support surface; after adsorbing said printed circuit board on said support surface, removing said pressing member placed on said printed circuit board while said support surface is charged; and after removing said pressing member, performing automatic appearance inspection on said printed circuit board adsorbed on said support surface.