| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device having a configuration capable of successfully performing wire bonding for an inner lead while downsizing the semiconductor device.SOLUTION: A semiconductor device comprises an inner lead 26i on a heat dissipation circuit board 20. The inner lead 26i includes inner lead posts 26p1 and 26p2 serving as a connected portion of a wire W1 to be wire-bonded. The inner lead posts 26p1 and 26p2 are rectangular, and the longitudinal directions thereof are arranged along a longitudinal direction of the heat dissipation circuit board 20.</p> |
